哎呀,这个职位已经下线啦
威讯联合半导体(北京)有限公司
Development Engineer
- 12万-22.8万/年
- 北京
- |
- 5年以上
- |
- 本科
- |
- 全职
职位诱惑: 年终奖,季度绩效,免费班车,免费工作餐,定期体检
发布时间: 2016-07-01发布
职位描述
Summary
- This position is under development engineering group of Qorvo Beijing
Job Responsibilities/Scope - Under general supervision of development manager for assembly process development tasks, include technical survey, process capability analysis, risk assessment, experiment design and execution.
- Follow up with relevant functional teams to get timely support and task update to meet factory/department development goal.
- Ensure the readiness to support the next generation manufacturing technology requirements.
- Collaborate with global packaging engineering team to understand the product roadmaps, timelines, and next generation product packaging technology requirements. Also, to understand the manufacturing technology needs and assess the gaps in the factory prototype and production capability
- Work closely with global packaging engineering team to design manufacture technology test vehicles as needed ahead of first BJ prototype builds.
- Collaborate on advanced design rules, characterize the capability improvement needs and define the gaps both in the process and equipment.
- Define plans, schedules, and actions ahead of first prototype builds to develop or improve prototype / HVM capability.
Qualifications - Bachelor degree, min 3-6 years of semiconductor assembly experience.
- Hands on process experience on Flip Chip, Die preparation and backend processes would be preferred.
职位发布者
Sandy 李硕
HR
7天
简历处理用时
95%