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恒诺微电子(嘉兴)有限公司

封装工艺工程经理(IC FOL ENG MGR)

  • 18万-30万/年
  • 嘉兴
  • |
  • 10年以上
  • |
  • 本科
  • |
  • 全职

职位诱惑: 年终奖金,五险一金,福利好,老板nice,免费班车,十五薪

发布时间: 2017-12-29发布

职位描述

Process Engineering Manager
 (IC Assembly FOL Engineering– based in China)
 
Requirements
 

  • Min Bachelors Degree in Engineering from an accredited university or equivalent experience.
  • Min 10 years experience in semiconductor assembly and test area. Process Engineering experience in both FOL and EOL assembly preferred. And at least 3 years at a managerial role.
  • Sound knowledge in DOE, APQP, PPAP, FMEA and Statistical Process Control.
  • Good oral and written communication skills, both English and Chinese.
  • Preferable and added advantage with experience in Leadframe, Package design and expertise in FOL and EOL process.
  • Good team player.
Job Description
  1. Key player in discussion with customers on all new package or new processes  and provide engineering solution to customers to balance operation requirements.
     
  2. Lead the engineering team to resolve all engineering issue internal and external.
     
  3. Responsible to lead the assembly engineering team to drive processes improvement to manufacture high quality world class in quality, cost and productivity.
     
  4. Ensure the required technical support for all critical process is available for production.
     
  5. Drive for CIP on quality, productivity, cost continuous improvements in all related manufacturing processes and efficiency.
     
  6. Communicate with customers (especially overseas in Europe/U.S.) effectively on technical issues, DFX, new product launches, and product quality improvement.
     
  7. Provide coaching and technical assistant to the NPI and assembly engineering team to immediate resolve internal and external technical unforeseen issue.

职位发布者

Eva Lu

HR

7天

简历处理用时

93%

简历及时处理率

恒诺微电子(嘉兴)有限公司

恒诺微电子(嘉兴)有限公司

领域: 消费电子

规模: 1000人以上

主页: http://www.hanagroup.com

工作地址:

浙江省嘉兴市秀洲工业园区恒诺路18号

查看完整地图