哎呀,这个职位已经下线啦
恒诺微电子(嘉兴)有限公司
封装工艺工程经理(IC FOL ENG MGR)
- 18万-30万/年
- 嘉兴
- |
- 10年以上
- |
- 本科
- |
- 全职
职位诱惑: 年终奖金,五险一金,福利好,老板nice,免费班车,十五薪
发布时间: 2017-12-29发布
职位描述
Process Engineering Manager
(IC Assembly FOL Engineering– based in China)
Requirements
- Min Bachelors Degree in Engineering from an accredited university or equivalent experience.
- Min 10 years experience in semiconductor assembly and test area. Process Engineering experience in both FOL and EOL assembly preferred. And at least 3 years at a managerial role.
- Sound knowledge in DOE, APQP, PPAP, FMEA and Statistical Process Control.
- Good oral and written communication skills, both English and Chinese.
- Preferable and added advantage with experience in Leadframe, Package design and expertise in FOL and EOL process.
- Good team player.
- Key player in discussion with customers on all new package or new processes and provide engineering solution to customers to balance operation requirements.
- Lead the engineering team to resolve all engineering issue internal and external.
- Responsible to lead the assembly engineering team to drive processes improvement to manufacture high quality world class in quality, cost and productivity.
- Ensure the required technical support for all critical process is available for production.
- Drive for CIP on quality, productivity, cost continuous improvements in all related manufacturing processes and efficiency.
- Communicate with customers (especially overseas in Europe/U.S.) effectively on technical issues, DFX, new product launches, and product quality improvement.
- Provide coaching and technical assistant to the NPI and assembly engineering team to immediate resolve internal and external technical unforeseen issue.
职位发布者
Eva Lu
HR
7天
简历处理用时
93%