IC EOL ENG MGR(封装后道工程科室经理)

岗位要求：
1.Min Bachelors Degree in Engineering from an accredited university or equivalent experience.

本科及以上学历，及工科背景。
2.Min 8 years experience in semiconductor assembly and test area. And at least 3 years at a managerial role.
8年以上的IC封装测试经验，至上三年以上的管理经验，精通IC封装后道流程工艺，特别是molding区域。
3.Good oral and written communication skills, both English and Chinese.
良好的英文和中文的读写， 沟通技能。
岗位职责：
1.Key player in discussion with customers on all new package  or new processes and provide engineering solution to customers to balance operation requirements
参与客户的新产品新工艺，并根据运营的需要提供工程解决方案。
2.Lead the ENG team to resolve all engineering issue internal and external
领导工程团队解决内部和外部的工艺相关问题。
3.Responsible to lead the engineering team to drive processes improvement to manufacture high quality world class in quality, cost and productivity
负责领导工程团队驱动工艺改善以达到高质量，低成本和高生产率。
4.Ensure the required technical support for all critical process is available for production.
确保关键的制程有必须的技术支持以保证生产。
5.Drive for CIP on quality, productivity, cost continuous improvements in all related manufacturing processes and efficiency.
驱动质量、生产率、成本等生产、工艺和效率相关的改善项目。
工作地点：浙江嘉兴