Design Service Technical Program Manager
- 18万-36万/年
- 深圳
- |
- 5年以上
- |
- 本科
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- 全职
职位诱惑: 年底双薪,交通补助
发布时间: 2018-07-25发布
职位描述
Major Responsibilities:
1) Responsible for owning communications with customers, factory personnel, suppliers, and factory design/characterization team members to insure the successful execution of design survey response,design project management;
2) Responsible for new project engagement since product concept stage to initiate the best solution to package design and continue to optimize electrical/mechnical/thermal quality to win business;
3) Responsible for design feasibility study,design verify,detailed package design works following design rule as well as coordinating design validation in NPI activities;
4) Responsible for on-site support at customer site(Business travel) in co-design of Chip-Package-Integration;
5) Responsible for supporting specific tasks assigned by Dept. supervisor.
Required Qualifications:
1.Education: BS at least in ME or EE ; MS is preferred
2.Experience:
-A minimum of 5 years of experience in package design is required
-Having independent package design experience at least on 4 kinds package applications among CABGA/ fcBGA/ fcCSP/ PoP/ WLP/ Bumping/ SiP is required;
-Having independent package design experience at least on 2 kinds product applications among Mobile AP/ Baseband/ RF/ PMIC/ FPS/ Lighting Sensor /3D-NAND
3.Special Skills or Qualifications:
- Expetised in package design with tools such as cadence (APD/Allergo), Sigrity UPD (Encore), AutoCAD, CAM350, and all Microsoft Office Applications (i.e. Excel, Word and Powerpoint)
- Good verbal and written English communications is required for interactions with external and internal customers(CET6)
- Knowledge of electrical, mechanical,and thermal, experience in assembly process & project management is preferred
- Ability of excellence work under high pressure,can-do attitude,good personality,honest,team work player