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Infineon Technologies AG

Senior Engineer-Die Bond Equipment for Discrete

  • 14.4万-19.2万/年
  • 无锡
  • |
  • 5年以上
  • |
  • 本科
  • |
  • 全职

职位诱惑: 德国独资企业 福利完善 工作氛围好 发展前景好

发布时间: 2017-01-12发布

职位描述

Job Description
L-ead engineering projects for D/B equipment, OEE/ MTBA/yield improvement, process optimization and cost saving, etc;
-Manage and lead a cross-functional team to develop and implement a rigorous unit process sustaining system;
-Lead or execute innovation projects on productivity increase, Equipment performance sustain and improvement.
-Develop Poka-yoke, automation and permanent solution Initiate;
-Spare parts management;
-Training material preparation for process change and new process implementation;
-Daily/weekly/monthly yield, MRB, DDM report review and disposition.
-Lead or work together with overseas colleagues for transfer or improvement projects.

Job Requirement
-Minimum bachelor degree with atomation/electrical and electronics/mechanical engineering.
-At least 5 years’ experience in semiconductor area. Having maintenance experience of TOSOK(JCM) , ASM, or ESEC Die Bond machine.
-Be Familiar with eutectic bond or glue bond process.
-Good knowledge of machine,process qualification, DMAIC, MSA, DOE, 8D, FMEA, SPC etc;
-Good communication skill in Chinese and English.
-Good team work and constructive problem solving skills.

职位发布者

tingting.han

7天

简历处理用时

100%

简历及时处理率

Infineon Technologies AG

Infineon Technologies AG

领域: 汽车电子

规模: 1000人以上

主页: http://www.infineon.com/

工作地址:

无锡新区新加坡工业园行创三路8号

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