Senior Engineer-Die Bond Equipment for Discrete
- 14.4万-19.2万/年
- 无锡
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- 5年以上
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- 本科
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- 全职
职位诱惑: 德国独资企业 福利完善 工作氛围好 发展前景好
发布时间: 2017-01-12发布
职位描述
Job Description
L-ead engineering projects for D/B equipment, OEE/ MTBA/yield improvement, process optimization and cost saving, etc;
-Manage and lead a cross-functional team to develop and implement a rigorous unit process sustaining system;
-Lead or execute innovation projects on productivity increase, Equipment performance sustain and improvement.
-Develop Poka-yoke, automation and permanent solution Initiate;
-Spare parts management;
-Training material preparation for process change and new process implementation;
-Daily/weekly/monthly yield, MRB, DDM report review and disposition.
-Lead or work together with overseas colleagues for transfer or improvement projects.
Job Requirement
-Minimum bachelor degree with atomation/electrical and electronics/mechanical engineering.
-At least 5 years’ experience in semiconductor area. Having maintenance experience of TOSOK(JCM) , ASM, or ESEC Die Bond machine.
-Be Familiar with eutectic bond or glue bond process.
-Good knowledge of machine,process qualification, DMAIC, MSA, DOE, 8D, FMEA, SPC etc;
-Good communication skill in Chinese and English.
-Good team work and constructive problem solving skills.