Principal Customer Engagement Engineer

职位描述：
Principal Customer Engagement Engineer-RF IC/Package/Board
Position Description:
1. The primary responsibility is designing, developing, troubleshooting and debugging software programs on Windows/Linux/Unix platforms.
2. Will be involved in developing software tools for advanced RF system design platforms.
3. The responsibilities also include engaging with customers in understanding their RF system design requirements from chip to package/board and assisting them in adopting Cadence advance RF system design platform.
4. The job will also involves presenting and demonstrating relevant Cadence technologies and carrying out product evaluations, workshops, trainings and competitive replacement campaigns.
Position Requirement:
1. Strong experience in RF SIP/board design including layout, modeling and simulation.
2. Good experience in RF IC design and simulation.
3. Experience in RF co-design/simulation from chip to package to board will a big plus.
4. Good English verbal and written presentation are must.
5. Minimum master degrees in EE or CS.