Development Engineer

Summary

• This position is under development engineering group of Qorvo Beijing
   
  Job Responsibilities/Scope
• Under general supervision of development manager for assembly process development tasks, include technical survey, process capability analysis, risk assessment, experiment design and execution.
• Follow up with relevant functional teams to get timely support and task update to meet factory/department development goal.
• Ensure the readiness to support the next generation manufacturing technology requirements.
• Collaborate with global packaging engineering team to understand the product roadmaps, timelines, and next generation product packaging technology requirements. Also, to understand the manufacturing technology needs and assess the gaps in the factory prototype and production capability
• Work closely with global packaging engineering team to design manufacture technology test vehicles as needed ahead of first BJ prototype builds.
• Collaborate on advanced design rules, characterize the capability improvement needs and define the gaps both in the process and equipment.
• Define plans, schedules, and actions ahead of first prototype builds to develop or improve prototype / HVM capability.
   
  Qualifications
• Bachelor degree, min 3-6 years of semiconductor assembly experience.
• Hands on process experience on Flip Chip, Die preparation and backend processes would be preferred.