封装工程师
- 7.2万-9.6万/年
- 合肥
- |
- 5年以上
- |
- 本科
- |
- 全职
职位诱惑: 五险一金,年终奖金,老板nice,年底双薪
发布时间: 2017-02-21发布
职位描述
Package Engineer
Responsibility:
? Responsible for providing total package solution on BGA, QFN, QFP & FCBGA packages
? Responsible for substrate design release and electrical / thermal simulation result recognition
? Manage production issues in subcontractors
? Working together with product/test/quality engineers to improve production yield
? Maintain and develop resource to support new prototype samples
? Price negotiation with suppliers
? Other jobs assigned by department supervisor
Qualification:
? M.S. or B.S. degree in engineering
? Over 5 years’ hands on experience at package house or fabless (subcontractor operation)
? Strong background on package development on BGA/QFP/QFN packages
? Experience in package process and yield improvement activities
? Ability on package feasibility study on substrate layout and bond ability check
? Familiar with SIP products
? Good mentoring, communication, presentation skills and team work
? Strong data analysis and technical problem solving skills
Preferred qualification:
? Experience on substrate layout
? Experience on package level electrical simulation
? Ever work background on wire bonding, especially on copper / alloy wires
? Project management or NPI experience