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合肥灿芯科技有限公司

封装工程师

  • 7.2万-9.6万/年
  • 合肥
  • |
  • 5年以上
  • |
  • 本科
  • |
  • 全职

职位诱惑: 五险一金,年终奖金,老板nice,年底双薪

发布时间: 2017-02-21发布

职位描述

Package Engineer
Responsibility:
?    Responsible for providing total package solution on BGA, QFN, QFP & FCBGA packages
?    Responsible for substrate design release and electrical / thermal simulation result recognition
?    Manage production issues in subcontractors
?    Working together with product/test/quality engineers to improve production yield
?    Maintain and develop resource to support new prototype samples
?    Price negotiation with suppliers
?    Other jobs assigned by department supervisor

Qualification:
?    M.S. or B.S. degree in engineering
?    Over 5 years’ hands on experience at package house or fabless (subcontractor operation)
?    Strong background on package development on BGA/QFP/QFN packages
?    Experience in package process and yield improvement activities
?    Ability on package feasibility study on substrate layout and bond ability check
?    Familiar with SIP products
?    Good mentoring, communication, presentation skills and team work
?    Strong data analysis and technical problem solving skills

Preferred qualification:
?    Experience on substrate layout
?    Experience on package level electrical simulation
?    Ever work background on wire bonding, especially on copper / alloy wires
?    Project management or NPI experience

职位发布者

戴小翠

7天

简历处理用时

98%

简历及时处理率

合肥灿芯科技有限公司

合肥灿芯科技有限公司

领域: 消费电子,智能硬件,汽车电子

规模: 50-100人

主页:

工作地址:

合肥市高新区望江西路860号高新区管委会B座8楼814号

查看完整地图