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威讯联合半导体(北京)有限公司

Senior Mold/Mark Process Engineer

  • 10.8万-21.6万/年
  • 北京
  • |
  • 5年以上
  • |
  • 本科
  • |
  • 全职

职位诱惑: 年终奖,季度绩效,免费班车,免费工作餐,定期体检

发布时间: 2016-07-01发布

职位描述

Responsibilities:
1.Dispose the abnormal production material and work out/drive the improvement actions with X-function team.
2.Lead the problem solution, internal or from customer, and drive the long term foolproof actions.
3.Initiate or lead the continuous improvement programs on yield and other operation issues. 
4.Generate and maintain the process documents, SPEC, control plan, FMEA, WI, etc. 
5.Set up the new product program and ensure the new product ramp up successfully. 
6.New vendor/material qualification and new technology development following technology roadmap.
7.Technical support to other team.

Requirements:
1.Bachelor degree in Engineering related. 
2.More than 2 years' experience in molding process engineering of semiconductor assembly industry.  
3.Good knowledge on semiconductor assembly equipment/material is a plus. 
4.Able to setup and conduct DOE for improvement or problem solution. 
5.Good at English, both on speaking and listening.

职位发布者

Sandy 李硕

HR

7天

简历处理用时

95%

简历及时处理率

威讯联合半导体(北京)有限公司

威讯联合半导体(北京)有限公司

领域: 移动手持,消费电子,军工航天

规模: 1000人以上

主页: http://www.qorvo.com

工作地址:

北京市经济技术开发区同济中路17号

查看完整地图