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Infineon Technologies AG

Senior Engineer-Die Bond Process

  • 14.4万-19.2万/年
  • 无锡
  • |
  • 5年以上
  • |
  • 本科
  • |
  • 全职

职位诱惑: 德国独资企业 福利完善 工作氛围好 发展前景好

发布时间: 2017-01-11发布

职位描述

Job Description
-Be responsible for yields, quality and cost sustainment and continuous improvement for Product Line.
-Dispose day-to-day internal abnormal case, deal with MRB and customer issue (FAR).
-Keep daily focus on line activities without any non-compliance and continuous improvement of line employees’ quality mindset .
-Initiate and update die bonding specification, FMEA, Control Plan ,failure catalogue and etc.
-Identify opportunity for improvement in current establish process.
-Conduct review on training content to ensure most process changes are included and follow procedure.
-Provide on-call services for shop floor critical application where necessary.

Job Requirement
-Bachelor Degree in Mechanism/ Electrical and Electronics/Automation Engineering .
-More than 5 years die bond experience in semiconductor backend field. 2 years' experience with die bonding machine or achievement in die bonding improvement project handling is a plus.
-Be Familiar with eutectic bond or glue bond process.
-Be familiar with most key die bond machine in the market, such as TOSOK(JCM) , ASM, ESEC.
-Solid knowledge of DMAIC, MSA, DOE, 8D, FMEA, control plan etc.
-Systematic logic thinking and problem solving skill.
-Be good at time management.
-Be able to work under pressure.
-Good communication skill in both Chinese and English.

职位发布者

tingting.han

7天

简历处理用时

100%

简历及时处理率