Senior Engineer-Die Bond Equipment for Chip Card

Job Description:
-Manage and lead a cross-functional team to develop and implement D/B machine performance improvement project (MTBA; MTBF , OEE/ yield improvement, and cost saving, etc;)
-Lead or execute innovation projects on productivity increase.
-Develop Poka-yoke, automation and permanent solution Initiates for problem solving.
-Spare parts management; localization and cost saving.
-Training material preparation for new machine setup, maintenance .
-Support technician or new engineer skill and knowledge improvement program.
-Support risk assessment for abnormal products.
-Lead or work together with oversea colleagues for transfer or improvement projects.

Job Requirement:
- Minimum bachelor degree with engineering background, mechanical engineering or electrical engineering will be preferred;
- At least 5 years’ experience in semiconductor area. Having maintenance experience of ESEC Die Bond machine is better.
- Good knowledge of machine,process qualification, DMAIC, MSA, DOE, 8D, FMEA, SPC etc;
- Good communication skill in Chinese,English or German;
- Good team work and constructive problem solving skills.