封装工程经理（Engineering Manager)

Requirements

• Min Bachelors Degree in Engineering from an accredited university or equivalent experience.
• Min 8 years experience in semiconductor assembly area. Process Engineering experience in both FOL and EOL assembly preferred. And at least 3 years at a managerial role. Applicant with more experience can apply for Senior Engineering Manager.
• Sound knowledge in DOE, APQP, PPAP, FMEA and Statistical Process Control.
• Good oral and written communication skills, both English and Chinese.
• Preferable and added advantage with experience in Leadframe, Package design and expertise in FOL and EOL process.
• Good team player.

Job Description
1.Key player in the NPI discussion with customers on all new package or new processes and provide engineering solution to customers to balance operation requirements
2.Lead assembly or NPI engineering team to execute SWR lots from FOL to Test without fail and resolve all engineering issue before mass production
3.Responsible to lead the assembly engineering team to drive processes improvement to manufacture high quality world class electronics product.
4.Ensure the required technical support for all critical process is available for production.
5.Drive for quality, productivity, cost continuous improvements in all related manufacturing processes and efficiency.
6.Communicate with customers (especially overseas in Europe/U.S.) effectively on technical issues, DFX, new product launches, and product quality improvement.
7.Provide coaching and technical assistant to the NPI and assembly engineering team to immediate resolve internal and external technical unforeseen issue.
工作地点：zhejiang jiaxing