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北京华芯通半导体技术有限公司

Hardware Mechanical Design Engineer – Mechanical/thermal design (2018 Fresh Graduate)

  • 10万-20万/年
  • 上海
  • |
  • 应届生/在校生
  • |
  • 硕士
  • |
  • 全职

职位诱惑: 年终奖金,五险一金,福利好,老板nice

发布时间: 2018-12-26发布

职位描述

 
Hardware Mechanical Design Engineer – Mechanical/thermal design (2018 Fresh Graduate)
 
Job Family:      Hardware Engineering
Job Title:         Mechanical Engineer
 
Position Description:
 
This position will be responsible for mechanical design of reference platform for Huaxintong’s ARM based processor.  The engineer will work in Huaxintong Software & System Group in Beijing/Shanghai.
 
Main Responsibility:
- Develop mechanical chassis enclosures for reference design platforms of Huaxintong’s ARM based processor.
- Co-work with PCB layout engineer to set up mechanical constrain for PCB boards.
- Engage in all aspects of mechanical design, including requirements definition, initial conceptual development, 3D drawing design, ID design, tolerance analysis, 2D drawing review, tooling review and manufacturing support.
- Perform first article inspection, rework and modification to meet design spec.
- Debug any issue found is mechanical and system test including shock vibration, drop, RVI, EMC, ESD, etc.
- Work with manufacturer on chassis production.
- Develop thermal solution for reference design system. Conduct thermal test as needed.
 
 
Required Skills:
 
- M.Sc. or Ph.D. degree from China top universities (211 is a must, 985 is preferred) with major on mechanical engineering, industrial design, thermal engineering, etc.
- Good academic record with GPA>3.7 and top 10% rank in the major.
- Familiar with 3D mechanical design tools such as ProE, Solidworks.
- Familiar with thermal simulation tools such as Flotherm, Icepak is a good plus.
- Experience on mechanical enclosure design using sheet metal and plastic.
- Excellent root cause analysis and problem solving skills.
- Experience on EMC/ESD/Thermal/Acoustic design.
- Experience on tolerance analysis, DFM, tooling.
- Excellent interpersonal and communication skills, good teamwork adaptability, good oral and written English skills, energetic and self-motivated.
- Graduate in spring/summer of 2018.

职位发布者

刘强

7天

简历处理用时

98%

简历及时处理率

北京华芯通半导体技术有限公司

北京华芯通半导体技术有限公司

领域: 消费电子,智能硬件,安全标签

规模: 200-500人

主页: http://www.hxt-semitech.com

工作地址:

张江高科

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