Package Signal Integrity (SI) / Power Integrity (PI) Engineer

Summary of Role:
   
    GLOBALFOUNDRIES Package SI/PI Engineer is responsible for large scale ASIC package model extraction, system-module SI/PI co-simulation, support ASIC chip designs on IO planning based on GLOBALFOUNDRIES 14nm, 7nm and beyond technology. Design of high-speed package escape patterns and power delivery structures. Develop advanced solutions of 2.5D, 3D package.
 
Responsibilities:
 Work scope includes but not limited to:
 - Define package netlist based on chip-package co-design methodology
 - IO planning together with physical designer - Package ERC checking, package design file checking - System-module SI/PI co-simulation
- Package design and SI/PI sign-off - Develop package design methodology
- Develop advanced 2.5D, 3D package solutions
The candidate would also have future extended responsibility participating in the design planning and sizing for the advanced ASIC/SoC chips, deployment and other application engineering support of the entire design system and end customers.
 
Requirements:
1. EE/ME/CS related background in system/chip development and research.
2. Knowledge and/or experience in one or more of the following areas: - Advanced package/system design experience. Knowledge in high speed interface (High Speed Serdes, HBM, DDR, USB, etc...) is a plus.
- Familiar with Industry SI/PI analysis process, system level modeling and finite element analysis tools (Ansys HSFF, Sigrity, SigXp, Spice, MATLAB, etc...).
- Mul-layers PCB/ Laminate layout experience.
3. Good grasp of programming language in Linux/Unix environment. Perl/TCL scripting is a plus.
4. Good communication skill in both English and Mandarin, and willingness to work with a global team. Skill in other languages is a plus.
 5. Understanding of ASIC physical design process/tools, advanced semiconductor technology process and device physics is a plus. 6. Strong teamwork sense, good learning competency, self-motivated, and ability to work in diverse areas in a flexible and dynamic environment.