Power Management IC Design Engineer

Analog Devices Autonomous Transportation and Safety/LIDAR group is seeking a Power Management IC design engineer for the newly formed Lidar Engineering team located at Shanghai, China. ADI's LIDAR group focuses on state of the art light detection/ranging and photoelectric product development for a wide range of markets. The China engineering team will focus on various areas in Lidar technologies including digital design and verification, power management IC, mixed-signal design, verification and layout, functional safety, as well as product evaluation and customer applications.  We are looking for a highly motivated individual to join the team to provide the much needed analog design expertise, especially in the area of power management IC.
 
Key responsibilities include:
·        Design analog or mixed-signal circuits blocks for Lidar technology group.  Possible circuits might include regulators, amplifiers, laser driver or converters
·        Work with other technical leaders to develop the architecture of the next generation Lidar IC products
·        Develop innovative circuits and concepts for new and derivative Lidar functions
·        Technically lead certain functions in the projects or possibly the entire projects
·        Become the technologist in power management IC related area for Lidar group
·        Become the main technical contributor of the project.  Support project manager to develop project plan and schedule.  Work with other functions in the project (e.g. digital, layout, backend) to assure proper and timely execution of the project
·        Work with the backend engineers in the lab to debug and analyze any issues of the existing silicon
·        Support marketing and application teams on new product definition
 
Qualifications:
·        Must have MS degree +5 years IC industry experience
·        Must have strong knowledge of engineering fundamentals
·        Must be familiar with power management circuits such as power switches, DC-DC converters, bandgap, LDO etc.
·        Must be able to collaborate in a team environment, and have strong presentation and communication skills in both English and Chinese
·        Nice to have design experience to handle circuits and devices with ultra-high voltage (>100V) and current (>30A)
·        Nice to have skill and knowledge related to high speed circuit design and consideration
·        Nice to be familiar with common packaging technologies (e.g. LFCSP, BGA, WLCSP etc)
·        Nice to be familiar with automotive qualification, and/or functional safety requirement and related project execution
·        Nice to have good laboratory measurement skills, debug and analytical skills