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英飞凌科技(中国)有限公司

Change Management Manager (PJM)-OSAT Development

收藏职位
  • 我要分享
  • 20万-30万/年
  • 上海
  • |
  • 5年以上
  • |
  • 本科
  • |
  • 全职

职位诱惑: 德国独资企业 福利完善 工作氛围好 发展前景好

发布时间: 2018-09-21发布

职位描述

职责描述:
Managing package development execution within product/technology development according to project milestone, quality & cost requirements.

Objective :
OSAT Development, Project Manager.
1.Drive a packaging team for new package development from development process post concept approval to launch.
2.Responsible to ensure all new package development is within timeline and budget and technical & Quality standards are 
3.Achieved to maximise profitability
4.Bring team together to ensure proper project execution within team member, BU partner and other interface
5.To deliver products to customers at committed functionality, reliability, time, volume and cost
6.Ensure compliance of control plan deployment and quality controls are met; understanding of key parameters definition and controls

General Task:
1.Managing package development execution within product/technology development according to project milestone, quality & cost requirements.
2.Responsible for samples build-up (e.g. first samples, ES1) and QS2)).
3.Responsible for transfer into manufacturing engineering.
4.Communication channel of dedicated project in OP BE to requestor (e.g. PGM)/PJM of PL, package group in PL (ATV PCK, PMM PCK), PFM4)).
5.Performing escalation to requestor and OP BE internal.
6.Providing Change Request to Project Office. 
7.Responsible for regular KLUSA reporting and milestone release in Documentum. 
8.Reporting in product team of PGM / PJM of PL and/or development board in OP BE Segment.
9.Aligned with chip/system development, test engineering for all technical, cost and quality aspects during project phase.
10.Patent filing and technical paper publishment.
11.Preventive / Corrective Action / Problem solving and trouble shooting of development issue.
12.Support Pacakge Definition group to ensure package platform complexity, product requirement, customer commitment are met.

任职要求:
You are best equipped for this task if you have:
1.At least 6 years of relevant working experience and thereof 2 years of leading projects 
2.Experience in semiconductor R&D in packaging group is preferred 
3.Has solid project management knowledge in terms of project initiation, planning and closing including reporting and documentation. 
4.Analytical mind and high initiative to challenge him/herself and the team to move the next level of competency. 
5.Experience in analytical tool, e.g. Surface analysis, material characterisation, DoE, D/PFMEA, 8D and simulation knowledge will be an added advantage 
6.IP management is preferred, e.g. patent filing.

职位发布者

金伟

HR

7天

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