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AMD

Sr. Packaging Engineer

收藏职位
  • 我要分享
  • 25万-45万/年
  • 苏州
  • |
  • 工作经验不限
  • |
  • 本科
  • |
  • 全职

职位诱惑: 接触顶尖技术

发布时间: 2018-09-30发布

职位描述


What you do at AMD changes everything 
At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 
Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.
 
Job Title:  Senior Engineer (Packaging Engineering, Vendor Management)
 

  1. Job Descriptions
·        Co-work with packaging BU on new product and technology development in Assembly manufacturing facility. Proactively communicate task assignments to responsible parties, and ensure that tasks are completed within the planned time. Track projects to project plans. Proactively report project status to stakeholders.
·        Plan and drive for New Product Introduction activities and Ramp Up readiness.
·        Drive Assembly manufacturer on issue resolution supporting packaging engineering
·        Timely execution of special work requests, with comprehensive reports.
·        Monitor performance of Assembly manufacturing site regarding yield, out of control lots disposition, and any outliers reporting from internal or external parties.
·        Plan and execute change management from internal or external parties.
·        Proactively drive towards continuous improvement in process simplification and quality enhancement, be it in internal and external environment.
·        Occasionally to support on site audit.
·        Assist in additional duties as deemed fit by supervisor.
 
 
2. Required skill sets
·        Min 3 years’ experience in Semiconductor assembly
·        Familiar with DOE and JMP.
·        MS degree in Mechanical or Material or Chemical Engineering
·        Creative, highly motivated self-driven individual with the demonstrated ability to independently complete complex engineering tasks
·        Good interpersonal communication and presentation skill
 

职位发布者

AMD

HR

7天

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98%

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