Staff Engineer-Test Development

Work with sub-con on product testing engineering; develop test programs and product specific test hardware like load boards/test heads; test solution integration and release to production; create design document; develop new test method and technology; sustain high volume production at sub-con to meet yield, test quality and test time target.

In your new role you will:

1. Develop backend test packages for RF ICs (switches, LNA, Coupler) used in current and future mobile applications (5G, IoT). Ensure yield targets in high volume production and optimize program for test time. Evaluate yield and perform root cause analysis of fails
2. Create test specification for RF ICs, align on content with IC Design, Project Management and other TE team members located at Infineon HQ and other worldwide locations
3. Program automated test equipment (ATE), design test hardware, perform test validation, correlation and debugging
4. Communicate and align new product introduction (NPI) at subcon. Drive first silicon test and test package integration/release to production sites. Support new product introductions on site at subcons. Keep close technical and organizational communication with subcons to ensure smooth ramp-up
5. Test technology development for RF ICs and modules, evaluate and introduce new test methods and test platforms to extend capabilities
6. Reduce the cost and improve the quality of existing test solutions through test method improvements and test platform conversion

1. Bachelor of Science degree in Electrical or Electronics Engineering from a credited institute
2. Minimum 5 years of experience developing production test solutions for RF ICs or modules using ATE
3. Solid knowledge in the principles of RF testing and test setups for small signal and large signal test. Experience in measurement equipment, PA, VNA and other RF instrument is required
4. Profound experience in ATE test systems. LTX/Xcerra PAx experience is ideal, Teradyne UltraFlex highly desirable
5. Hands-on test programming skills and experience programming in C / C++ and VBasic. Substantial knowledge of version control systems like SVN or Git is beneficial
6. Experience designing PCBs using schematic capture tools such as OrCAD / Cadence Allegro. Knowledge in RF layout principal and signal integrity is required
7. Deep understanding of NPI process, silicon/package development, quality system for test qualification and release
8. Demonstrated record in high volume production test enabling, yield analysis and failure analysis
9. Skills working in a multicultural team setup within a high dynamic environment. Fluency in English and Mandarin is mandatory