Staff Subcon Engineer(OSAT Management)
- 20万-40万/年
- 上海
- |
- 5年以上
- |
- 本科
- |
- 全职
职位诱惑: 年终奖金,五险一金,技术领先,成长空间大
发布时间: 2018-12-26发布
职位描述
Responsibilities:
• First contact for technical topics and escalations by subcon.
• Drives & Improves subcon Assembly performance index (yield, line disturbances, etc).
• Supports closure of line disturbance, low yield lots and maverick issues.
• Coordinates with PE and Fab team or Quality on wafer related issues.
• Be part of New Product Ramp team and manages safe launch.
• Drive new subcon enabling (technical & Supply Chain & IT).
• Supports technical capability assessments in subcon.
• Keep track of subcon capability in terms of process, equipment and package.
• Manage/Coordinate Change Management at subcon.
• Supports FA activities including analysis of rootcause and improvement action in subcon.
Requirements:
• More than 3 years of assembly process experience. Direct experience on flipchip is a plus.
• At least 2 years of Subcon management experience.
• Good process, assy engineering and equipment maintenance knowledge.
• Knowledge in Package Failure Analysis.
• Basic test process and product engineering know-how is an advantage.
• Able to work well with all level of people (internal & external).
• Be able to initiate mentoring and guidance to Subcon engineers.
• Good communication skills in both written and spoken English.