Senior Engineer-Die Bond Process

Responsible for making timely and accurate decisions regarding non-conforming product or equipment / process outputs using state-of-the-art semiconductor process equipment in one selected assigned area.

In your new role you will:

1. Process yield monitoring sustenance & improvement through constant follow up,
   line communication & data analysis with systematic approach
2. lead team for customer complaint & feedback in identification of root cause &
   corrective actions
3. Disposition of on hold lots on time to minimize impact on CLIP & Range
4. Disposition for non compliance material encountered in production
5. Process document upkeep eg ,Process Specification, Control Plan, FMEA, Work
   Instruction & Assembly Chip sheets.
6. Sample building for internal & external qualification.
7. New process & product introduction and qualification

1. Bachelor Degree in Electrical and Electronics Engineering or Equipment equivalent.
2. More than 5 years process and equipment experience in semiconductor backend field.
3. Solid knowledge of DMAIC, MSA, DOE, 8D, FMEA, control plan etc. ( better with green belt)
4. Systematic logic thinking and problem solving skill.
5. Be good at time management.
6. Be able to work under pressure.
7. Good communication skill in both Chinese and English.