BG&Dicing Principle PE

1、Responsible for the process development of 8 or 12 inches wafer of BG&Tape&Dicing process;
2、Responsible for prepare related documents used on BG&Tape&Dicing equipment process buyoff and material evaluation;
3、Responsible for BG&Tape&Dicing process related technology transfer work, and solve problems in technology transfer wafer bond, confirmation, ensure product yield and cycle time reach the established target;
4、Responsible for make BG&Tape&Dicing and assistant process work instruction;
5、Responsible for optimizing and maintenance BG&Tape&Dicing and assistant process stabilization;
6、Responsible for wafer bonder and assistant equipment parameter monitor, and create preventive flow about out of spec limit issue;
7、Responsible for evaluation 2nd resource，include: material、tools、Jig、 etc.;
8、Organizing meetings and making decisions on abnormal status;
9、Make of NG and low yield products related disposal mothed and documents;
10、Responsible for training of new process engineers.
1、负责8寸、12寸晶圆BG&Tape&Dicing及相关工艺的开发；
2、负责BG&Tape&Dicing及相关工艺、材料的评估；
3、负责优化BG&Tape&Dicing及相关工艺流程，并制定相关作业指导书；
4、负责BG&Tape&Dicing及相关工艺的量产化及工艺的维护和优化；
5、负责BG&Tape&Dicing及相关工艺技术转移，解决BG&Tape&Dicing及相关工艺转移过程中出现的问题，使产品良率和cycle time达到既定目标；
6、负责BG&Tape&Dicing及相关工艺测试参数，对超出spec的产品做异常处理及预防；
7、负责BG&Tape&Dicing及相关工艺新耗材及2nd source耗材评估；
8、决策受BG&Tape&Dicing及相关工艺影响的产品能否release；
9、制定BG&Tape&Dicing及相关工艺不合格产品报废；
10、负责训练新进工程师

任职要求:
1、More than 5 year’s experiences of process engineer in FAB or packaging line;
2、Experience in process supporting to BG&Tape&Dicing(Disco\Nitto), and have high-level off-site training;
3、Strong hands-on and communication skills;
4、Knowledge of SPC\DOE\FMEA and so on;
5、Skilled use of MS、 analysis software;
6、Have an outstanding of English ability;
7、Have a sense of innovation and team work.
1、5年以上半导体FAB、或封装线设备工艺工程师工作经验；
2、对Disco\Nitto等设备有实际工作经验，并接受过高等级的场外培训；
3、有SPC\DOE\FMEA\8D等知识；
4、具有探索创新意识，工作积极主动；
5、能熟练应用Word、Excel、PPT等办公软件；
6、英文能力突出；
7、工作认真细致，有创新意识，有团队精神。