Wafer Bonding Principle PE

1、Responsible for the process development of 8 or 12 inches wafer of wafer bonding process;
2、Responsible for prepare related documents used on wafer bonding equipment process buyoff and material evaluation;
3、Responsible for wafer bond process related technology transfer work, and solve problems in technology transfer wafer bond, confirmation, ensure product yield and cycle time reach the established target;
4、Responsible for make wafer bond and assistant process work instruction;
5、Responsible for optimizing and maintenance wafer bond and assistant process stabilization; 
6、Responsible for wafer bonder and assistant equipment parameter monitor, and create preventive flow about out of spec limit issue;
7、Responsible for evaluation 2nd resource，include: material、tools、Jig、 etc.; 
8、Organizing meetings and making decisions on abnormal status;
9、Make of NG and low yield products related disposal mothed and documents;
10、Responsible for training of new process engineers.
1.  负责8寸、12寸晶圆级临时键合和永久键合工艺的开发；
2.  负责晶圆级键合、拆键合设备、材料的评估；
3.  负责优化键合及后段相关工艺流程，并制定相关作业指导书；
4.  负责晶圆级临时键合、拆键合、永久键合工艺的量产化及工艺的维护和优化；
5.  负责晶圆键合及后段相关工艺技术转移，解决键合及后段相关工艺转移过程中出现的问题，使产品良率和cycle time达到既定目标；
6.  负责键合及后段相关工艺测试参数，对超出spec的产品做异常处理及预防；
7.  负责键合及后段相关工艺新耗材及2nd source耗材评估；
8.  决策受键合及后段相关工艺影响的产品能否release；
9.  制定键合及后段相关工艺不合格产品报废；
10. 负责训练新进工程师。

任职要求：
1、More than 8 year’s experiences of process engineer in 8'or 12'FAB;
2、Experience in process supporting to wafer bonder EVG or SUSS, and have high-level off-site process training;
3、Knowledge of SPC\DOE\FMEA \Control plan\8D and so on;
4、Outstanding English listening and speaking skills;
5、Skilled use of MS、 analysis software;
6、Have a sense of innovation and team work.
1、五年以上8寸或12寸半导体FAB工艺工程师工作经验；
2、有晶圆键合EVG或SUSS设备使用经验，并接受过高等级场外培训；
3、有SPC\DOE\FMEA\8D等知识；
4、具有探索创新意识，工作积极主动；
5、能熟练应用Word、Excel、PPT等办公软件；
6、英文能力突出；
7、工作认真细致，有创新意识，有团队精神。