Senior Engineer (Packaging Engineering, Vendor Management)

1. Job Descriptions
• Co-work with packaging BU on new product and technology development in External Assembly manufacturing facility. Proactively communicate task assignments to responsible parties, and ensure that tasks are completed within the planned time. Track projects to project plans. Proactively report project status to stakeholders.
• Plan and drive for New Product Introduction activities and Ramp Up readiness.
• Drive external Assembly manufacturer on issue resolution supporting packaging engineering
• Timely execution of special work requests, with comprehensive reports.
• Monitor performance of external Assembly manufacturing site regarding yield, out of control lots disposition, and any outliers reporting from internal or external parties.
• Plan and execute change management from internal or external parties.
• Proactively drive towards continuous improvement in process simplification and quality enhancement, be it in internal and external environment.
• Provide disposition to out-of-control lots and present for Material Review Board (MRB).
• Occasionally to support on site audit.
• Assist in additional duties as deemed fit by supervisor.


2. Required skill sets
 Min 3 years’ experience in Semiconductor assembly, especially in Flip Chip assembly processes, where bumping experience is added bonus.
 Familiar with DOE and JMP.
 Bachelor/MS degree in Mechanical or Material or Chemical Engineering
 Creative, highly motivated self-driven individual with the demonstrated ability to independently complete complex engineering tasks
 Good interpersonal communication and presentation skill
 Good in writing and speaking in English