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英特尔半导体(大连)有限公司

Technology Development Process Engineer (Etch/TFP/CMP/Litho/DEI)

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  • 我要分享
  • 35万-70万/年
  • 大连
  • |
  • 3年以上
  • |
  • 硕士
  • |
  • 全职

职位诱惑: 年终奖金,五险一金,福利好,老板nice,年底双薪,股票期权,免费班车,技能培训,节日礼物,技术领先,成长空间大

发布时间: 2019-07-02发布

职位描述

The selected candidates will be responsible for activities covering process, equipment, materials, and operations in their respective areas of expertise, such as Etch/TFP/CMP/Litho/DEI. Examples of scope of work include silicon process improvement and product enhancement, equipment capability evaluation and expansion, and wafer cost reduction. 
Candidates must have demonstrated a track record of excellence in creative problem solving, equipment capability enabling, or manufacturing process optimization in a relevant engineering organization.
 
Responsibilities include:
·       Perform feasibility study and provide module level process solutions to meet desired device specification and process improvement requirements
·        Lead new process experimentation, implementation and high volume manufacturing readiness in the area of expertise
·       Minimum 3 years of direct experiences in TD or related field.
·       Define, select and qualify the equipment platforms to meet quality and output needs of new processes for high volume manufacturing ramp.
 
Education (Desired degree & major)
·       Must have a Master/ PHD in Electrical engineering, Computer engineering, or engineering/science in related field.
 

职位发布者

Intel HR

HR

7天

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