Technology Development Process Engineer (Etch/TFP/CMP/Litho/DEI)

The selected candidates will be responsible for activities covering process, equipment, materials, and operations in their respective areas of expertise, such as Etch/TFP/CMP/Litho/DEI. Examples of scope of work include silicon process improvement and product enhancement, equipment capability evaluation and expansion, and wafer cost reduction. 
Candidates must have demonstrated a track record of excellence in creative problem solving, equipment capability enabling, or manufacturing process optimization in a relevant engineering organization.
 
Responsibilities include:
·       Perform feasibility study and provide module level process solutions to meet desired device specification and process improvement requirements
·        Lead new process experimentation, implementation and high volume manufacturing readiness in the area of expertise
·       Minimum 3 years of direct experiences in TD or related field.
·       Define, select and qualify the equipment platforms to meet quality and output needs of new processes for high volume manufacturing ramp.
 
Education (Desired degree & major)
·       Must have a Master/ PHD in Electrical engineering, Computer engineering, or engineering/science in related field.