关注微信 意见反馈

扫描关注摩尔人半导体招聘

摩尔人招聘
确定
查看帮助中心
对职位有兴趣?上传您的简历无需注册,即可直接投递您心仪的职位
沃瑞咨询【专业半导体猎头】

Senior Principle Al WB Engineer

收藏职位
  • 我要分享
  • 40万-60万/年
  • 苏州
  • |
  • 10年以上
  • |
  • 硕士
  • |
  • 全职

职位诱惑: 年终奖金,五险一金,福利好,老板nice,技能培训,成长空间大

发布时间: 2019-08-28发布

职位描述

Duties and Responsibilities
1. Responsible for Assembly Process Development and Characterization for Code-S and Enabling Technology in Semiconductor FOL (Front of Line) area as Process Development Engineer
A. Major Process Responsibility on Wire Bonding (Heavy Al Wire Bonding)  
B. Capable to understand and discuss proposed design and new proposal upgraded  
C. Capability understanding Design FMEA, upgrading DFMEA and making Process FMEA from DFMEA
D. Capability to define KPIV from FMEA Failures Modes
E. Capability to define KPOV and making result of KOPV and analysis from it
F. Responsible for providing Technical reports with satisfying KPIV versus KPOV from FMEA failures modes based on JMP analysis
G. Working with development engineers to generate and create documents deliverables such as preliminary Control Plan from D/PFMEA according to APQP procedure
H. Responsible for Sharing and Communication with Development Engineers and Manufacturing Engineers
 
2. Pro typing Line Sample Building and Line Equipments Maintenance & Management
A. Capable for Equipment and Tooling Set-up
B. Responsible for Tool and JIG design understanding working with designers and vendors for new development tool designs (Al & Au wire bonding clamp design, other jig design)
C. Responsible for readiness of tools and Jigs meeting target schedule without EON owner’s schedule impacts to generate proper outputs within schedule
D. Responsible to meet EON cycle time on Technology Development
E. Leading Proto Typing Line Operators to do right job
F. Sharing technical issues and new result to related EON owners and manufacturing engineering team
 
3.  Technical Leadership on Assembly Process
A. Capable to initiate new Process and new Equipment working with development engineers and vendors
B. Responsible for PO Spec. generation and Buy-off
C. Capable to create COO for Process and Equipment Comparison
D. Capable for Benchmarking New and Better Process and Equipment’s that does not exist in company
E. Capability to create Assembly Technology Roadmap
F. Capability to generate Characterization and out of design Rule by Co-work with Dev. Engineer and NPI Process engineers  
G. Capable to understand customer requirements, application, EHS and design
H. Capable to find technical and systematic solution and schedule for failures of process, reliability, quality, manufacturability, cost, and cycle time that are related with process
I. Supporting Production Related Quality Issues for Manufacturing
J. Leading the Pre-work and supporting Code-S with NPI Process Engineers
K. To share and update project progress, risk of delay, constraints by weekly report and update technical Web site and report to manager
 
 
Qualifications
 
· Master's degree material science with proven record in new process introduction
· Longer than 10+ years in Harvey Al Wire bonding area, Al wire bonding (K&S, Choonpa). 
· Experienced jobs : Semiconductor Assembly Process Development, Equipment and Tooling set-up, process/equipment/material troubleshooting and control, Purchase spec/selection, Qualification for equipment and material, Experience of consulting on Leadframe design, Soft Solder and Ag Epoxy bonding clamp design, Al wire bonding clamp
· Experienced packages: Semiconductor Packages. Highly Preferred Power discrete (like TO220, D-Pak, D2PAK) and Power module packages (like SPM, IPM, IGBT/Diode module)
· Skills: Communication skills, written English and speaking with multi-cultural foreign engineers, JMP & Data analysis. Skilled Excel Spreadsheet and Power Point Presentation.
Other characteristics such as personal characteristics : Self-motivated, independent, open mind to communicate, be willing to take risk and managing

职位发布者

Roger Tang 汤冯喆

Recruitment Expert

7天

简历处理用时

99%

简历及时处理率

您还未登录。已有账号, 点此登录,直接投递

推荐朋友

一键投递