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英特尔半导体(大连)有限公司

Thin Film Engineering Manager Test

收藏职位
  • 我要分享
  • 30万-60万/年
  • 大连
  • |
  • 5年以上
  • |
  • 本科
  • |
  • 全职

职位诱惑: 五险一金,技术领先,成长空间大

发布时间: 昨天发布

职位描述

Thin Film Engineering Manager
Job Description
Dalian is home to DMTM, Intel's first memory fabrication site. DMTM is a state of the art memory maker and manufacturer, its 3D NAND Chip was born to shake up the market with its low cost and higher performance technology. As Memory and storage are key drivers of growth for Intel, the work being done at DMTM is critical to our long-term vision for success. For every piece of memory we sell, we build further inroads to other Intel key growth areas-IoT, data center, and CPU opportunities. Memory is a part of the foundation of technology that powers the smart, connected world we hope to bring to everyone.

Intel Dalian is rapidly expanding its 3D NAND high volume manufacturing facility, And now we are seeking for many strong candidates to join Thin film Dept. In this position, you will be reporting to Thin Film Area Manager of Process Engineering and directing a PE module team with up to 10 engineers.
Responsibilities include, but are not limited to:
Managing the engineering team and cross-functional engagement with the operation teams to support company objectives of manufacturing quality, throughput, yield, and uptime.
Leading the sustaining, transfer and ramp of 3D NAND technology for Intel DMTM CVD group.
Providing management for proactive tactical planning and execution of the production ramp, resource planning and/or management, and tool and labor productivity improvements
Leading and coordinating both process engineering and manufacturing equipment teams to develop inventive module strategies and systems to improve execution and efficiency in a high-volume manufacturing environment to achieve both operation and equipment excellence under LEAN principle.

Qualifications

You should possess a MS or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry or Chemical Engineering
8+ years of direct semiconductor industry, preferably in CVD processing and engineering on AMAT or LAM platforms.
3+ years of people managing experience. Strong team building, decision-making and people management skills.
Strong analytical and critical thinking skills: focus on driving disciplined, data-based decisions and executing with discipline and urgency.
Proven inspirational, adaptive leadership style that promotes innovation and collaboration that fosters and engaged workforce committed to common goals.
Excellent communication skills - with both technical and non-technical associates and customers
Demonstrated the capability of working in and leading a high performing team culture which includes: setting high expectations, driving accountability to those expectations, role modeling the desired culture, possess excellent teamwork, demonstrated problem solving and prioritization skills, and driving high performance maintenance goals for the group.
Inside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.
 

职位发布者

Intel HR

HR

7天

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