封装工程师（驻厂）

Job description:
This contributor will work on the design and development of package solution for UHV GaN-on-Si power device / Co-package SiP and RF power amplifier device.
The job responsibilities include:
1. Work with design, technology and applications engineering teams to design packaging
a)Power QFN/DFN, Flip chip and Cu Clip Packages and co-package Si control IC & GaN power FET SiP solution;
b)TSV process / plastic and ceramic packaging for RF power amplifier devices .
2. Design and co-work with third-party to implement thick RDL to improve performance and efficiency of power products;
3. Develop thermal models to predict thermal behavior and verify simulation results with actual measurements;
4. Interface closely with the company's design team and package suppliers to select the best technologies available. Communicate supplier ground rule and process capabilities to design engineering and marketing teams to assist in the selection of appropriate packaging on new programs ;
5. Maintain product quality while developing and introducing cost effective package solutions;
6. Coordinate the introduction of new package assembly processes/materials into volume production 6. Perform package characterization and manufacturing studies to select the optimum process parameter for high assembly yields ;
7. Select and qualify new vendors and manufacturing suppliers to support quick turn assembly builds;
8. Provide package applications support to customers and assist in answering Board/System level technical questions ;
9. Failure Analysis – participant and report.
 
 
Minimum Requirements:
BS or above in Electronic Engineering, Engineering Physics or a related engineering degree Minimum 5 years of experience on power and RF device packages.
Preferred Qualifications and Skills:
1. Deep understanding of power and RF device packaging ;
2. Familiarity with analyzing mechanical & current distribution simulation results during package ;
3. Experience on GaN on Silicon power device packaging is preferred ;
4. Working knowledge of statistical process controls and failure analysis ;
5.Demonstrated ability to work within schedule constraints ;
6. Excellent communication and team skills ;
7. Technical documentation experience.