(Sr.) Die Bond Engineer

Job Responsible:
1. Identify problems or unfavorable process deviations and execute/implement corrective/improvement actions
2. Take the lead on customer complaint investigation and 8D responsibilities
3. Daily monitoring and dispose on abnormal/maverick lots, low yield lots.
4. To training and compile process documentation filling and update, WI, FMEA…
5. Provide sustaining engineering support to the manufacturing team through detailed failure analysis, technical support, documentation revisions, assembly support, and training support to resolve issues in a timely fashion
6. Work on continue improvement project to simplify/improve the flow/system which can reduce the system loop
holes or ease the daily task

Job Requiremnet:
1. At least 3-4 years experience on semiconductor assembly area, main focus on Die Attach process and bachelor in EE
2. Need to be able to accept changes from time to time . Must be stress tolerance as we are directly dealing with production
3. Good communication skills and team work spirit. Good English read and writing skills, oral English is also preferred
4. Excellent Microsoft office application skill